Silicon recess etch and epitaxial deposit for shallow trench isolation (sti)

ABSTRACT

Some embodiments of the present disclosure relate to a method. In this method, a semiconductor substrate, which has an active region disposed in the semiconductor substrate, is received. A shallow trench isolation (STI) structure is formed to laterally surround the active region. An upper surface of the active region bounded by the STI structure is recessed to below an upper surface of the STI structure. The recessed upper surface extends continuously between inner sidewalls of the STI structure and leaves upper portions of the inner sidewalls of the STI structure exposed. A semiconductor layer is epitaxially grown on the recessed surface of the active region between the inner sidewalls of the STI structure. A gate dielectric is formed over the epitaxially-grown semiconductor layer. A conductive gate electrode is formed over the gate dielectric.

REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.13/854,507 filed on Apr. 1, 2013, which claims priority to U.S.Provisional Application No. 61/792,327 filed on Mar. 15, 2013, thecontents of both of these applications are incorporated by reference intheir entirety.

BACKGROUND

Shallow trench isolations (STIs) are used to separate and isolate activeareas on a semiconductor wafer from each other. STIs may be formed byetching trenches, overfilling the trenches with a dielectric such as anoxide, and then removing any excess dielectric with a process such aschemical mechanical polishing (CMP) or etching in order to remove thedielectric outside the trenches. This dielectric helps to electricallyisolate the active areas from each other.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1K are partial cross sectional views illustrating steps of oneembodiment of forming a device in accordance with the disclosure.

FIG. 1L is a partial cross sectional view of a MOS type transistorhaving a structure based on the method illustrated in FIGS. 1A-1K inaccordance with one embodiment of the disclosure.

FIG. 2 is a flow diagram that shows a method similar to that of FIGS.1A-1K for the fabrication of a device such as that illustrated in FIG.1L in accordance with one embodiment of the disclosure.

FIG. 3 is a graph that illustrates how the recess etch plus epi growthprocess according to one embodiment of the disclosure provides for areduction in threshold voltage mismatch.

FIG. 4 is an SEM partial cross section that illustrates a loading effectin a wet etch process for forming fin type structures that results in avariation in resultant feature thickness.

FIGS. 5A-5F are partial cross section views illustrating steps ofanother embodiment of forming fins for a FinFET type device using arecess etch and epi growth followed by a multi-part dry etch inaccordance with the disclosure.

FIG. 6 illustrates a flow diagram of some embodiments of a method forthe fabrication of the fins in FIGS. 5A-5E in accordance with thedisclosure.

FIG. 7 illustrates a flow diagram of some embodiments of a method forthe fabrication of the fins in FIGS. 5A-5F in accordance with thedisclosure.

DETAILED DESCRIPTION

The description herein is made with reference to the drawings, whereinlike reference numerals are generally utilized to refer to like elementsthroughout, and wherein the various structures are not necessarily drawnto scale. In the following description, for purposes of explanation,numerous specific details are set forth in order to facilitateunderstanding. It may be evident, however, to one of ordinary skill inthe art, that one or more aspects described herein may be practiced witha lesser degree of these specific details. In other instances, knownstructures and devices are shown in block diagram form to facilitateunderstanding.

The isolation of semiconductor devices on a single chip is an importantaspect of modern metal-oxide-semiconductor (MOS) and bipolar integratedcircuit technology for the separation of different devices or differentfunctional regions. With the high integration of semiconductor device,improper electrical isolation among devices will cause current leakage,which in turn can consume a significant amount of power, as well ascompromise functionality.

Shallow trench isolation (STI) is a preferred electrical isolationtechnique for a semiconductor chip with high integration. Conventionalmethods of producing a STI feature include forming a hard mask, forexample silicon nitride, over a targeted trench layer including athermally grown pad oxide layer and patterning a photoresist over thehard mask to define a trench feature. After patterning, etching isperformed through the openings in the hard mask to create recesses inthe silicon regions of the silicon substrate. An insulating material,such as oxide or other suitable material, is deposited in the recessesand on the hard mask. A chemical mechanical planarization (CMP) is thenperformed to remove the insulator material on top of the hard mask andplanarize the top of the STI region. The chemical mechanicalplanarization stops on the hard mask. Following the planarization, thehard mask layer is removed from the top of the silicon substrate. Whenthe hard mask is a nitride, for example, this is achieved by etchingwith hot phosphoric acid.

One problem associated with formation of the STI feature is that duringthe acidic wet etching processes to remove the hard mask layer and thepad oxide layer, over-etching frequently occurs leading to removal ofexposed STI material during and after the hard mask layer and the padoxide layer have been removed. The formation of such etching defectsadversely affects the electrical integrity of semiconductor devices,including altering the threshold voltage of a field effect transistor(FET), altering the device off-state current, and making the devicesusceptible to reverse short channel effects.

FIGS. 1A-1K are cross-sectional views of the formation of trenchisolation structures at various stages in the STI manufacturing processin accordance with various embodiments of the present disclosure. Itwill be understood for ease of illustration that while only one trenchisolation structure is illustrated in the Figures, additional STIstructures are usually formed on the semiconductor body 100 at the sametime. Referring to FIG. 1A, a semiconductor body 100 including asemiconductor substrate 102 is illustrated. Substrate 102 is understoodto include a semiconductor wafer or substrate, comprised of asemiconducting material such as silicon or germanium, or a silicon oninsulator structure (SOI). A sacrificial oxide layer 104 is providedoverlying substrate 102. In some embodiments, sacrificial oxide layer104 is a pad oxide layer. Pad oxide layer 104 includes a silicon dioxidegrown by a thermal oxidation process. For example, the pad oxide layer104 can be grown in a rapid thermal oxidation process (RTO) or in aconventional annealing process including oxygen at a temperature ofabout 800° C. to about 1150° C. In some embodiments, the pad oxide layer104 has a thickness of about 50 angstroms to about 200 angstroms. A hardmask layer 106 is formed over pad oxide layer 104. The hard mask layer106 can be formed by a low pressure chemical vapor deposition (LPCVD)process. For example, the precursor including dichlorosilane (DCS orSiH₂Cl₂), bis(tertiarybutylamino)silane (BTBAS or C₈H₂₂N₂Si), ordisilane (DS or Si₂H₆) is used in the CVD process to form the hard masklayer 106. The hard mask layer 106 can be silicon nitride or siliconoxynitride. In some embodiments, the hard mask layer 106 has a thicknessranging from about 400 angstroms to about 1500 angstroms.

Following formation of the hard mask layer 106, a photoresist mask 108is deposited and patterned by exposing the photoresist mask 108 to alight pattern and then performing a developing process. As shown in FIG.1B, the hard mask layer 106 is patterned by anisotropically etching(shown as arrows 110) using the photoresist mask 108 as an etch mask. Insome embodiments, a reactive ion etching (RIE) process is used toanisotropically etch through hard mask layer 106 and the pad oxide layer104 into the semiconductor substrate 102 to form a trench 112.Subsequently, any remaining photoresist mask 108 is removed according toan ashing process (not shown), with the resulting structure as shown 100in FIG. 1C.

In FIG. 1D, following formation of the STI trench 112, in someembodiments, an insulating liner material 114 is thermally andconformally grown in the trench 112, along the bottom and at least aportion of the sidewalls. STI liner 114, in some embodiments, may be asilicon dioxide liner with a thickness up to about 300 angstroms. TheSTI liner 114 may be formed by oxidation using an oxygen gas, or oxygencontaining gas mixture, to oxidize the silicon on the surface of theopenings 112 of the STI. For example, the STI liner 114 may be formed byoxidizing the exposed silicon in an oxygen environment at a temperaturefrom about 900° C. to about 1100° C. In some embodiments, an annealingprocess may be performed after the STI liner 114 is deposited to preventcrystalline defects due to the oxidation process.

Referring to FIG. 1E, following formation of the STI liner 114, a CVDprocess is carried out to fill STI trench 112 with a dielectric material116. In some embodiments, dielectric material 116 is silicon oxide. Invarious examples, the dielectric material 116 can be formed by a highdensity plasma chemical vapor deposition (HDPCVD). The dielectricmaterial may be alternatively formed by a high aspect ratio process(HARP). Following deposition of the dielectric material 116, aconventional annealing process, for example, a rapid thermal annealing(RTA) process is optionally carried out, to densify the dielectricmaterial 116 and to reduce its wet etch rate(s). The densificationprocess can be performed in a furnace or a RTA chamber. In someembodiments, the process is performed at a temperature ranging fromabout 900° C. to about 1100° C. in an RTA chamber for a duration ofabout 10 seconds to about 1 minute.

After trench 112 filling is completed, a CMP process is carried out inFIG. 1F to remove dielectric material 116 overlying the hard mask layer106 and define filled trench 112 and top surface portion 117 ofdielectric material 116. In some embodiments, the hard mask layer 106may serve as a CMP polish stop where the CMP process is stopped on thehard mask layer 106. In some embodiments other processes may be used toachieve the similar polishing effect, for example, an etch-back processmay be used to remove the dielectric material 116 overlying the hardmask layer 106.

Following the CMP process, a wet oxide etch process may be performed toadjust the height of the top surface portion 117 of the dielectricmaterial 116 in the STI trench 112 in anticipation of the removal of thehard mask layer 106 and pad oxide layer 104. In order for the surface ofthe substrate to be flat for easier and better photolithographicpatterning, a portion of the dielectric material 116 in the trench 112is removed by etch. In some embodiments, the dielectric material 116removal is performed by a dilute HF dip. In some embodiments, the HF dipwill be repeated to remove further dielectric material 116. In someembodiments, the targeted amount of dielectric material 116 removed isin a range from about 200 angstroms to about 1300 angstroms. FIG. 1Gillustrates the resulting structure after the dilute HF dip, inaccordance with some embodiments. In some embodiments, the dilute HF dipis prepared by mixing HF with water at a ratio, such as 50:1 water toHF. As a result of the dilute HF dip, at the corners of trench 112, aV-shaped dip 122(a), 122(b), also referred to as a STI divot, is formedowing to a high local etch rate.

After the HF dip is performed to lower the top surface portion 117 ofthe dielectric material 116, the hard mask layer 106 is removed byetching, as shown in FIG. 1H. A well implant step is then performed (notshown) in active areas regions (e.g., regions 132, 134) that areadjacent to the STI trench in which the dielectric material 116 resides.Semiconductor body 100 can then undergo further processing, such as toremove the pad oxide layer 104 used in patterning and implanting thediffusion regions (not shown). The resulting structure is shown in FIG.1I. Such removal processes can further increase the recess issue (STIdivot) 122(a), 122(b). These divots 122(a), 122(b) negatively impact thephotolithography of the gate patterning and possibly inter-level (ILD)gap-fill between gate structures.

In order to address these issues, following removal of the pad oxidelayer (104), a recess etch process 124 is performed to remove a topsurface portion 136 of the exposed semiconductor material in the activeareas adjacent the STI trench, to provide a reduced surface portion 138of the active region, wherein an amount of removed semiconductormaterial is shown at reference numeral 140, as illustrated in FIG. 1J.The reduced surface portion 138, in some embodiments, is provided by therecess etch process 124, for example, a reactive ion etch for a processtime of from about 10 seconds to about 100 seconds. In some embodiments,etching is performed to a predetermined depth 140 of from about 10 nm toabout 30 nm.

In FIG. 1K, following the recess etch process 124 to provide the reducedsurface portion 138, a semiconductor layer 142 is formed overlying thereduced surface portion 138 of the active region 132, 134 of thesemiconductor body 100 to define a raised surface portion 144. In someembodiments, raised surface portion 144 is formed by an epitaxialprocess 146. The raised surface portion 144 may include, in someembodiments, an un-doped silicon. In some embodiments, the epi growthprocess may include a selective epitaxy growth (SEG) process, CVDdeposition techniques (e.g., vapor-phase epitaxy (VPE) and/or ultra-highvacuum CVD (UHV-CVD)), molecular beam epitaxy, other suitable epiprocesses, or combinations thereof. The epi process may use gaseousand/or liquid precursors. In some embodiments, the epi process may beperformed for a process time of from about 200 seconds to about 500seconds at a temperature of from about 660° C. to about 760° C.Semiconductor body 100 can then undergo further processing, for example,deposition of a thermal oxide layer overlying the epitaxially depositedsemiconductor layer.

In one embodiment, as shown in FIG. 1K, the amount of semiconductormaterial 142 formed in the active area has a thickness 146 that is lessthan an amount 140 of material that was previously removed at FIG. 1J.In this manner, the divots at the STI corners are reduced and in somecases eliminated, along with the deleterious effects associatedtherewith. Further, as a top portion 144 of the semiconductor material142 is lower with respect to a top portion of the STI dielectric 116,the outer diameter of the semiconductor material 142 is constrained bythe STI structure, thereby reducing or eliminating bending of thesemiconductor material 142, which could otherwise occur if formed at ahigher level and cause uncontrolled strain (e.g., a tensile strain) thatmay affect carrier mobility in an uncontrolled fashion. The recess etch124 followed by the reduced semiconductor formation (e.g., a reduced epideposition) 146 eliminates, or at least substantially reduces, thisuncontrolled bending and associated effect on carrier mobility.

FIG. 1L illustrates a partial cross section diagram of a MOS transistorformed with the process set forth in FIGS. 1A-1K. In FIG. 1L, STIregions 160 are formed in a semiconductor body 162, and define an activearea region 164 there between. In the active area region, a recess etchsuch as that shown in FIG. 1J is made, for example to a depth of about25 nm, following by an epi deposition such as that illustrated in FIG.1K, which an epi regrowth thickness 166 that is less that the recessetch depth, for example, a growth of about 18 nm. In one embodiment theepi regrowth is performed un-doped to form an intrinsic layer. A gatestructure 170 is formed with extension region implants to form extensionregions 172, followed by formation of spacers 174, and then asource/drain implant to form source/drain regions 176 in the active area164. In the embodiment of FIG. 1L, the source/drain regions 176 aredeeper than the intrinsic silicon region 168 in the channel portionbelow the gate structure 170.

FIG. 2 illustrates a flow diagram of a method 300 for formation of adevice according to some embodiments of the disclosure. While method 300is illustrated and described below as a series of acts or events, itwill be appreciated that the illustrated ordering of such acts or eventsare not to be interpreted in a limiting sense. For example, some actsmay occur in different orders and/or concurrently with other acts orevents apart from those illustrated and/or described herein. Inaddition, not all illustrated acts may be required to implement one ormore aspects or embodiments of the description herein. Further, one ormore of the acts depicted herein may be carried out in one or moreseparate acts and/or phases.

At 302 a semiconductor body is provided. An STI trench is formed in thesemiconductor body at 304. One example of such an STI trench is shown inFIGS. 1C-1D at 112.

At 306, the STI trench is filled with a dielectric material, followed byremoval of a hard mask and any sacrificial oxide layer overlying thesemiconductor body at 308. A resultant structure may be seen, forexample, in FIG. 1I.

At 310, the active region between STI trenches is etched (i.e., a recessetch) to define a reduced surface portion. One non-limiting example ofsuch a reduced surface portion is at 138 in FIG. 1J. At 312, asemiconductor layer is epitaxially deposited over the reduced surfaceportion. One example of a resultant structure with the epi portion isprovided at 142 in FIG. 1K. The top surface portion of the deposited epiis below the surface of the semiconductor body prior to performing therecess etch, such that the resultant grown epi is “constrained” by theside portions of the STI regions, thereby preventing uncontrolledstrains from forming in the epitaxial region in the active area. Thisreduction in uncontrolled strain allows for reduced mismatch in varioustypes of transistor properties such a device threshold voltage, forexample.

FIG. 3 is a graph illustrating a large number of material along theX-axis, and a measure of local mismatch along the Y-axis. As illustratedat 150, the material to the left thereof labeled “Si epi only”represents material that is formed over the active area, while thematerial to the right of 150 labeled “Recess etch plus Si epi”represents material in which a recess etch was performed in the activearea following by an epi formation there over such that the epi is fullylaterally constrained by the STI regions. As can be seen from FIG. 3,the top trace 152 shows an amount of threshold voltage (Vt) mismatch forNMOS devices, while the bottom trace 154 shows an amount of Vt mismatchfor PMOS devices. FIG. 3 clearly shows that the recess etch plus Si epiprocess provides for better control, for example, by reducing an amountof uncontrolled straining of the intrinsic epi layer in the activeregion by being constrained laterally by the STI regions.

It has also been found that the foregoing silicon recess etch may beutilized in other type device structures. Thus, in another embodiment,for example, a bulk fin field effect transistor (FinFETs), a pluralityof fins are formed from the substrate material. The fins may be formedwith different densities on the substrate. In some instances, a recessetch followed by an epi deposition in the active area can be performedprior to the formation of the fins. Conventional etch processes make itdifficult to uniformly form the fins in the active area due to loadingeffects, and commonly result in residue left on sidewalls of the finstructures, as well as the formation of fins of non-uniform width. FIG.4 is a scanning electron microscope (SEM) picture illustrating aplurality of fins 180, wherein the fins exhibit a substantial variationin thickness. This can be seen by the line 182 that shows a degree ofloading in terms of a variation in fin width laterally across the activearea. Generally, it is desirable that the resultant fins be uniform,since the size of the fin structure can in some instances have an impacton the resultant transistor device performance. Therefore having uniformfin structure can aid in providing uniform device operation.

According to one embodiment of the disclosure, a multi-step dry etchprocess is employed in conjunction with the recess etch and epiformation process to form a plurality of fins in the active area,wherein the fins exhibit a more uniform thickness there between.

Referring to FIG. 5A, STI regions 200 are formed in a semiconductor body202 in a manner similar to that described above in one embodiment. Aregion 204 interposed between the STI regions 200 is the active area. Arecess etch 206 is then performed, as shown in FIG. 5B, wherein aportion 208 of the silicon body is removed. The locations in which therecess etch 206 may be performed may be delineated by forming a mask 210prior to the etch in order to selectively expose those particular activeareas in which the recess etch is to be performed.

An epitaxial layer formation process 212 is then performed, as shown inFIG. 5C, to form an epitaxial layer 214 in the active area 204 over theportion that was subject to the earlier recess etch. A thickness 216 ofthe epitaxial layer 214 is selected to be less than a depth 208 of therecess etch, such that a top surface portion 216 of the resultantepitaxial layer 214 is lower than a top portion of the STI regions 200,and thus the epitaxial layer 214 is laterally constrained by the STIregions 200, resulting in less uncontrolled strain. In one embodiment ofthe disclosure, the epitaxial layer 214 is undoped, and thus comprisesan intrinsic silicon layer.

Referring now to FIG. 5D, a new mask 220 is formed over the active area204 and patterned to form openings 222 associated with trenches to beformed in the epitaxial layer 214 and the underlying semiconductor body202, to define the fins for FinFET devices. Referring to FIG. 5E, inorder to eliminate difficulties associated with convention etchprocesses resulting in non-uniform fin width, according to an embodimentof the disclosure, a multi-step etch process 230 is then performedutilizing a dry etch tool to etch the intrinsic silicon layer 214 andunderlying semiconductor body 202 to define the fins in the active area204. In a first etch step of the etch process 230, a breakthrough etchis performed to break through any native oxide that has formed over theepitaxial layer 214. The breakthrough etch employs a mask, for example,a patterned photoresist mask or a patterned hard mask to define theareas to be etched. In one embodiment, the breakthrough etch processutilizes a combination of CH₂F₂/CF₄/He, a pressure of about 10 mT, apower of about 300 W, a bias voltage of about 40 V, a CH₂F₂ flow rate ofabout 10 sccm, a CF₄ flow rate of about 90 sccm, and an He flow rate ofabout 200 sccm. Following the breakthrough etch, using the same mask 220of FIGS. 5D-5E, a second etch step of the etch process 230 is performedwhich utilizes a combination of NF₃/He/Cl₂, a pressure of about 80 MT, apower of about 825 W, a bias voltage of 0 V, a NF₃ flow rate of about 5sccm, a He flow rate of about 200 sccm, and a Cl₂ flow rate of about 100sccm. In one embodiment, the second portion of the multi-step etchprocess 230 is performed with no bias. The dry etching removes theexposed portions of the epitaxial layer and, depending upon the desireddepth, a portion of the underlying semiconductor body 202 to form thefins 224. In one embodiment, a depth 232 of the resultant dry etch isshown in FIG. 5E, however, in other embodiments the depth may be deeperor more shallow.

A final part of the multi-step etch process 230 is an ash, such as an O₂ash that is employed to clean away any etch byproducts caused by thefirst two steps. In one embodiment the O₂ ash is performed at a pressureof 10 mT, a power of 730 W, and a voltage bias of 40V. The O₂ flow is200 sccm and a chuck temperature in one embodiment (from inner to outer)is 60-60-60-60, and the ash duration is 30 seconds. In one embodiment,the O₂ ash removes the mask 220, particularly when the mask is aphotoresist type mask, however, in another embodiment where the mask 220is another material, a further mask removal process may be employed,resulting in the structure shown in FIG. 5F. As shown in FIG. 5F, awidth 240 for each of the fins 224 is more uniform, and thus forms atighter distribution. With a more uniform fin size, resultant FinFETdevice parameters are more uniform, thus providing better processcontrol.

FIG. 6 is an SEM photograph illustrating a plurality of fins 250 formedby the recess etch, epi growth, and multi-step dry etch fin formationprocess highlighted above in FIGS. 5A-5F. As can be seen by line 252, anamount of loading induced variation in fin thickness across the activearea is substantially reduced compared to the result of the conventionalpattering shown in FIG. 4. In fact a slope of the angled curve 182 inFIG. 4 is about 6.1, while the slope of the curve 252 in FIG. 6 is about0.8. As can be seen therefrom the fin formation method of FIGS. 5A-5Fprovide for a much greater fin dimension control, and thus in morestable, predictable FinFET operating characteristics.

FIG. 7 illustrates a method 400 for formation of fins in an active areafor formation of one or more FinFET devices according to anotherembodiment of the disclosure.

At 402, there is provided a plurality of STI structures comprising STItrenches etched into a semiconductor body comprising a silicon substratehaving an active region there between.

At 404, the STI trenches are filled with a dielectric material. Aresultant STI structure is shown for example at 200 in FIG. 5A.

At 406, a top surface portion of the semiconductor body in the activearea region is etched (i.e., a recess etch) to define a reduced surfaceportion of the active region. An example of the resultant structure isshown in FIG. 5B.

At 408, an epitaxial layer is formed in the recess etch portion in theactive area, which a thickness of the epitaxial layer is less than adepth of the recess etch. In the above manner, the epitaxial layer islaterally constrained by the STI regions in the active area. In oneembodiment the epitaxial layer is formed to a thickness of about 18 nmin a recess of about 25 nm, and the epitaxial material comprisesintrinsic silicon. One example of such a resultant layer is shown inFIG. 5C.

At 410, a multi-step dry etch is performed to pattern the epitaxiallayer and perhaps a portion of the semiconductor body there below. Inone embodiment, the multi-step etch process utilizes a dry etch tool toetch the intrinsic silicon layer and perhaps a portion of the underlyingsemiconductor body to define the fins in the active area. In a firstetch step of the etch process at 410, a breakthrough etch is performedto break through any native oxide that has formed over the epitaxiallayer. The breakthrough etch employs a mask, for example, a patternedphotoresist mask or a patterned hard mask to define the areas to beetched. In one embodiment, the breakthrough etch process utilizes acombination of CH₂F₂/CF₄/He, a pressure of about 10 mT, a power of about300 W, a bias voltage of about 40 V, a CH₂F₂ flow rate of about 10 sccm,a CF₄ flow rate of about 90 sccm, and an He flow rate of about 200 sccm.Following the breakthrough etch, using the same mask (e.g., mask 220 ofFIGS. 5D-5E), a second etch step of the etch process at 410 is performedusing a fluorine and chlorine based plasma chemistry using a heliumcarrier gas in a medium vacuum without a biasing of the substrate. Thedry etching removes the exposed portions of the epitaxial layer and,depending upon the desired depth, a portion of the underlyingsemiconductor body 202 to form the fins 224. In one embodiment, a depth232 of the resultant dry etch is shown in FIG. 5E, however, in otherembodiments the depth may be deeper or more shallow.

The embodiments described above provide methods for forming STIstructures which reduce or eliminate problems associated with STI divotformation, thereby overcoming electrical performance shortcomings in acompleted semiconductor device.

It will be appreciated that equivalent alterations and/or modificationsmay occur to one of ordinary skill in the art based upon a readingand/or understanding of the specification and annexed drawings. Thedisclosure herein includes all such modifications and alterations and isgenerally not intended to be limited thereby. In addition, while aparticular feature or aspect may have been disclosed with respect toonly one of several implementations, such feature or aspect may becombined with one or more other features and/or aspects of otherimplementations as may be desired. Furthermore, to the extent that theterms “includes”, “having”, “has”, “with”, and/or variants thereof areused herein, such terms are intended to be inclusive in meaning—like“comprising.” Also, “exemplary” is merely meant to mean an example,rather than the best. It is also to be appreciated that features, layersand/or elements depicted herein are illustrated with particulardimensions and/or orientations relative to one another for purposes ofsimplicity and ease of understanding, and that the actual dimensionsand/or orientations may differ substantially from that illustratedherein.

Therefore, some embodiments of the present disclosure relate to amethod. In this method, a semiconductor substrate, which has an activeregion disposed in the semiconductor substrate, is received. A shallowtrench isolation (STI) structure is formed to laterally surround theactive region. An upper surface of the active region bounded by the STIstructure is recessed to below an upper surface of the STI structure.The recessed upper surface extends continuously between inner sidewallsof the STI structure and leaves upper portions of the inner sidewalls ofthe STI structure exposed. A semiconductor layer is epitaxially grown onthe recessed surface of the active region between the inner sidewalls ofthe STI structure. A gate dielectric is formed over theepitaxially-grown semiconductor layer. A conductive gate electrode isformed over the gate dielectric.

Other embodiments relate to a method. In this method, a semiconductorsubstrate is received with an active region disposed in thesemiconductor substrate. A shallow trench isolation (STI) structure thatlaterally surrounds the active region is formed. An entire upper surfaceof the active region bounded by the STI structure is recessed to belowan upper surface of the STI structure. The recessed upper surfaceextends continuously between inner sidewalls of the STI structure andleaves upper sidewall portions of the STI structure exposed. Asemiconductor layer is epitaxially grown on the recessed surface of theactive region semiconductor body. An etch is performed to removeportions of the epitaxial layer in the active region to form a pluralityof fins in the active region.

Still other embodiments relate to a method. In this method, a siliconsubstrate with an active region disposed in the silicon substrate isreceived. A shallow trench isolation (STI) structure that laterallysurrounds the active region is formed. An upper surface of the activeregion bounded by the STI structure is recessed to below an uppersurface of the STI structure. The recessed upper surface extendscontinuously between inner sidewalls of the STI structure and leavesupper sidewall portions of the STI structure exposed. A silicon layer isepitaxially grown on the recessed surface of the active region. Theepitaxially-grown silicon layer has an upper surface which is convex andwhich meets a plane corresponding to an upper surface of the siliconsubstrate at an angle of about 0.8 degrees.

The disclosure further relates to a method of forming a semiconductorarrangement, comprising providing an STI structure comprising two STItrenches etched into a semiconductor body comprising a silicon substratehaving an active area region there between, and filling the STI trencheswith a dielectric material. The method further comprises removing a topsurface portion of the semiconductor material in the active area regionto define a reduced surface portion of the active area region, andforming an un-doped epitaxial layer over the reduced surface portion inthe active area region. The method further comprises forming a patternedmask to define a plurality of regions in the active area region, andpatterning the un-doped epitaxial layer in the active area region toform one or more fins in the active area region. In one embodimentpatterning the un-doped epitaxial layer comprises performing abreakthrough etch using a mask with a combination of CH₂F₂/CF₄/He, apressure of about 10 mT, a power of about 300 W, a bias voltage of about40 V, a CH₂F₂ flow rate of about 10 sccm, a CF₄ flow rate of about 90sccm, and an He flow rate of about 200 sccm, followed by performing azero bias etch of the un-doped epitaxial layer comprising a combinationof NF₃/He/Cl₂, a pressure of about 80 MT, a power of about 825 W, a biasvoltage of 0 V, a NF₃ flow rate of about 5 sccm, a He flow rate of about200 sccm, and a Cl₂ flow rate of about 100 sccm. The multi-step dry etchprocess may further comprise performing an oxygen ashing to remove etchbyproducts after performing the multi-step dry etch process.

What is claimed is:
 1. A method, comprising: receiving a semiconductorsubstrate with an active region disposed in the semiconductor substrate;forming a shallow trench isolation (STI) structure that laterallysurrounds the active region; recessing an upper surface of the activeregion bounded by the STI structure to below an upper surface of the STIstructure, wherein the recessed upper surface extends continuouslybetween inner sidewalls of the STI structure and leaves upper portionsof the inner sidewalls of the STI structure exposed; epitaxially growinga semiconductor layer on the recessed surface of the active regionbetween the inner sidewalls of the STI structure; forming a gatedielectric over the epitaxially-grown semiconductor layer; and forming aconductive gate electrode over the gate dielectric.
 2. The method ofclaim 1, wherein the gate dielectric is formed by a thermal oxidation ofthe epitaxially-grown semiconductor layer.
 3. The method of claim 1,further comprising: forming first and second source/drain regions in thesemiconductor substrate on opposite sides of the conductive gateelectrode.
 4. The method of claim 3, wherein lowermost portions of thefirst and second source/drain regions extend deeper into thesemiconductor substrate than a lowermost portion of theepitaxially-grown semiconductor layer.
 5. The method of claim 3, whereinthe epitaxially-grown semiconductor layer exhibits an absence ofgermanium.
 6. The method of claim 1, wherein the epitaxially-grownsemiconductor layer is formed to a thickness that leaves an uppersurface of the epitaxially-grown semiconductor layer beneath a planecorresponding to an upper surface of the STI structure.
 7. The method ofclaim 1, wherein the epitaxially-grown semiconductor layer has an uppersurface residing below an upper surface of the semiconductor substrate.8. The method of claim 1, wherein the STI structure has an upper surfaceextending above the upper surface of the semiconductor substrate.
 9. Themethod of claim 1, wherein the upper surface of the active region isrecessed by approximately 25 nanometers.
 10. The method of claim 9,wherein the epitaxially-grown semiconductor layer has a thickness ofabout 18 nanometers.
 11. The method of claim 1, wherein theepitaxially-grown semiconductor layer has an upper surface which isconvex and which meets a plane corresponding to an upper surface of thesemiconductor substrate at an angle of about 0.8 degrees.
 12. A method,comprising: receiving a semiconductor substrate with an active regiondisposed in the semiconductor substrate; forming a shallow trenchisolation (STI) structure that laterally surrounds the active region;recessing an entire upper surface of the active region bounded by theSTI structure to below an upper surface of the STI structure, whereinthe recessed upper surface extends continuously between inner sidewallsof the STI structure and leaves upper sidewall portions of the STIstructure exposed; epitaxially growing a semiconductor layer on therecessed surface of the active region semiconductor body; performing anetch to remove portions of the epitaxial layer in the active region toform a plurality of fins in the active region.
 13. The method of claim12, wherein the etch comprises a multi-step etch process, comprising:performing a breakthrough etch to remove any native oxide; andperforming a zero bias etch of the epitaxially-grown layer comprising acombination of fluorine and chlorine with a helium carrier gas.
 14. Themethod of claim 12, wherein the epitaxially-grown semiconductor layerhas an upper surface which is convex and which meets a planecorresponding to an upper surface of the semiconductor substrate at anangle of about 0.8 degrees.
 15. A method, comprising: receiving asilicon substrate with an active region disposed in the siliconsubstrate; forming a shallow trench isolation (STI) structure thatlaterally surrounds the active region; recessing an upper surface of theactive region bounded by the STI structure to below an upper surface ofthe STI structure, wherein the recessed upper surface extendscontinuously between inner sidewalls of the STI structure and leavesupper sidewall portions of the STI structure exposed; epitaxiallygrowing a silicon layer on the recessed surface of the active region;wherein the epitaxially-grown silicon layer has an upper surface whichis convex and which meets a plane corresponding to an upper surface ofthe silicon substrate at an angle of about 0.8 degrees.
 16. The methodof claim 15, further comprising: forming a gate dielectric over theepitaxially-grown silicon layer; and forming a conductive gate electrodeover the gate dielectric.
 17. The method of claim 16, wherein the gatedielectric is formed by a thermal oxidation of the epitaxially-grownsilicon layer.
 18. The method of claim 16, further comprising: formingfirst and second source/drain regions in the silicon substrate onopposite sides of the conductive gate electrode, wherein lowermostportions of the source/drain regions extend deeper into the siliconsubstrate than a lowermost portion of the epitaxially-grown siliconlayer.
 19. The method of claim 15, further comprising: performing anetch to remove portions of the epitaxially grown silicon layer in theactive region to form a plurality of fins in the active region.
 20. Themethod of claim 15, wherein the etch comprises a multi-step etchprocess, comprising: performing a breakthrough etch to remove any nativeoxide; and performing a zero bias etch of the epitaxially-grown siliconlayer comprising a combination of fluorine and chlorine with a heliumcarrier gas.